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10g Silicone Thermal CPU Paste Tube

HEATGREASE10

Provide improved heat transfer between CPU and heatsink through a silicon compound

$7.99 USD
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This thermal paste can be used to improve the effectiveness of a CPU cooler by thermally bonding the CPU to the heatsink, allowing the heatsink and fan to work at their full capacity to remove harmful heat from the CPU.

The StarTech.com Advantage
  • Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
  • Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
  • Ceramic based compound that is electrically non-conductive for safe use around electronics

What's in the box

Features
  • Ceramic-based compound containing silicon
  • Thermal conductivity of more than 1.066W/m-K
Applications
  • Replace old or dried out thermal paste
  • System builders who put together many low-end to mainstream systems
Product Numbers
Dell Harmony A1668623
D and H HEATGREASE10
Ingram Micro USA 524240
UPC Code 065030785686
Product appearance and specifications are subject to change without notice.

Technical Specifications

Warranty 2 Years
Bleed <0.05% at 200°C/24 hours
Carton Quantity 200
Color White
Evaporation <0.001% at 200°C/24 hours
Humidity 10% ~ 80% RH
Operating Temperature -20°C to 100°C (-4°F to 212°F)
Product Height 0.71 in [18 mm]
Product Length 1.18 in [30 mm]
Product Weight 0.49 oz [14 g]
Product Width 2.83 in [72 mm]
Shipping (Package) Weight 0.07 lb [0 kg]
Specific Gravity 2.3
Storage Temperature -50°C to 150°C (-58°F to 302°F)
Thermal Resistance <0.195°C-m2/W
Thermal Conductivity >1.066 W/(m·K)
Certifications, Reports and Compatibility

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HEATGREASE Thermal CPU Paste Compound for Heatsink Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound
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Downloads

Data Sheet
HEATGREASE10.pdf