1.5g Metal Oxide Thermal CPU Paste Compound Tube for Heatsink
Product ID: SILVGREASE1
Provide optimal heat transfer between CPU and heatsink through a metal oxide compound
Metal-based compound containing metal oxide
Thermal conductivity of more than 1.93 W/m-K
Negligible electrical conductivity
Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.
A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.
The StarTech.com Advantage
- Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
- High demand applications, such as overclocking and high performance CPUs
- Replace old or dried out thermal paste
|ASI Distribution USA||82888|
|D and H||SILVGREASE1|
|Ingram Micro USA||071614|
|Thermal Conductivity||>1.93 W/m-K at 25 °C|
|Thermal Resistance||<0.120 °C-in2/W at 25 °C|
|Bleed||<0.05% at 150°C/24 Hours|
|Evaporation||<0.001% at 150°C/24 Hours|
|Specific Gravity||>1.7 at 25 °C|
|Materials||Silicone Compounds 50%
Carbon Compounds 30%
Metal Oxide Compounds 20%
|Product Length||2.6 in [67 mm]|
|Product Width||0.8 in [20 mm]|
|Operating Temperature||-30°C to 180°C (-22°F to 356°F)|
|Shipping (Package) Weight||0 lb [0 kg]|
|What's in the Box|
|Included in Package||1 - 1.5g Tube of Silver Based Thermal Grease|
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound
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