Computer Parts / Computer Fans & Coolers / HSFPHASECM

Heatsink Thermal Pads - Pack of 5

HSFPHASECM
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Improves heat transfer between a CPU/chipset and heatsink with easy-to-use thermal pads

$7.99 USD
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In Stock: United States : 708 Canada : 68
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This 5 pack of Thermal Pads offers a suitable alternative to using heatsink paste/grease. The thermal pads remain solid at room temperature, and soften at heatsink operating temperatures - eliminating the mess of heat grease, while maximizing heat conduction to create a cooler operating environment for your hard working CPU.

The StarTech.com Advantage
  • Easy "peel and stick" installation ensures an even application each time
  • Mess free
Features
  • Low thermal impedance
  • Electrically non-conductive
  • Solid at room temperature, it softens at heatsink operating temperatures
  • Conforms to surface irregularities
Applications
  • Replaces traditional heatsink grease
Product Numbers
Dell Harmony A1310458
TechData Dis 10546570
ASI Distribution USA 88369
D and H HSFPHASECM
Ingram Micro USA G08128
Synnex US STA-HSFPHASECM
UPC Code 065030809191
Product appearance and specifications are subject to change without notice.

Technical Specifications

Warranty Information
Warranty 2 Years
Performance
Thermal Conductivity 0.7 W/m-k
Thermal Resistance 0.03 °C-in/W @ 50 PSI
Specific Gravity 1.11
Physical Characteristics
Color Pink
Materials Phase Change Temperature: 58°C

Volume Resistivity: 1x 1015 Ohm-cm
Product Length 1.2 in [30 mm]
Product Width 1.2 in [30 mm]
Product Height 0 in [0.1 mm]
Environmental
Operating Temperature -60°C to 125°C (-76°F to 257°F)
Special Notes / Requirements
Note Heatsink/Component Clamping Pressure (Recommended): 5 to 100 PSI (0.035 to 0.690 MPa)
Packaging Information
Package Quantity 5
Shipping (Package) Weight 0 lb [0 kg]
What's in the Box
Included in Package 5 - Thermal Pad
Certifications, Reports and Compatibility

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