Computer Parts / Computer Fans & Coolers / HSFPHASECM
Heatsink Thermal Pads - Pack of 5
HSFPHASECM
Improves heat transfer between a CPU/chipset and heatsink with easy-to-use thermal pads
$7.99 USD
In Stock: United States : 180 Canada : 54
This 5 pack of Thermal Pads offers a suitable alternative to using heatsink paste/grease. The thermal pads remain solid at room temperature, and soften at heatsink operating temperatures - eliminating the mess of heat grease, while maximizing heat conduction to create a cooler operating environment for your hard working CPU.
The StarTech.com Advantage
- Mess free
- Easy "peel and stick" installation ensures an even application each time
What's in the box
Features
- Conforms to surface irregularities
- Solid at room temperature, it softens at heatsink operating temperatures
- Electrically non-conductive
- Low thermal impedance
Applications
- Replaces traditional heatsink grease
Product Numbers
| Dell Harmony | A1310458 |
| TechData Dis | 42602B |
| ASI Distribution USA | 88369 |
| D and H | HSFPHASECM |
| Ingram Micro USA | G08128 |
| Synnex US | STA-HSFPHASECM |
| UPC Code | 065030809191 |
Product appearance and specifications are subject to change without notice.
Technical Specifications
| Warranty | 2 Years |
| Note | Heatsink/Component Clamping Pressure (Recommended): 5 to 100 PSI (0.035 to 0.690 MPa) |
| Carton Quantity | 30 |
| Color | Pink |
| Materials | Phase Change Temperature: 58°C
Volume Resistivity: 1x 1015 Ohm-cm |
| Operating Temperature | -60°C to 125°C (-76°F to 257°F) |
| Package Quantity | 5 |
| Product Height | 0.01 in [0.1 mm] |
| Product Length | 1.18 in [30 mm] |
| Product Width | 1.18 in [30 mm] |
| Specific Gravity | 1.11 |
| Thermal Conductivity | 0.7 W/m-k |
| Thermal Resistance | 0.03 °C-in/W @ 50 PSI |
| Shipping (Package) Weight | 0.04 lb [0 kg] |
Certifications, Reports and Compatibility
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