Heatsink Thermal Pads - Pack of 5
Product ID: HSFPHASECM
Improves heat transfer between a CPU/chipset and heatsink with easy-to-use thermal pads
Low thermal impedance
Solid at room temperature, it softens at heatsink operating temperatures
Conforms to surface irregularities
353 | Canada:
We will transfer stock to fulfill your order at no extra cost. If the quantity shown for our US warehouse isn’t enough to fulfill your order, we will transfer the required stock from our Canadian warehouse.
Same Day Shipping +on in-stock items from USA if ordered by 5pm ET*
This 5 pack of Thermal Pads offers a suitable alternative to using heatsink paste/grease. The thermal pads remain solid at room temperature, and soften at heatsink operating temperatures - eliminating the mess of heat grease, while maximizing heat conduction to create a cooler operating environment for your hard working CPU.
The StarTech.com Advantage
- Easy "peel and stick" installation ensures an even application each time
- Mess free
- Replaces traditional heatsink grease
|ASI Distribution USA||88369|
|D and H||HSFPHASECM|
|Ingram Micro USA||G08128|
|Thermal Conductivity||0.7 W/m-k|
|Thermal Resistance||0.03 °C-in/W @ 50 PSI|
|Special Notes / Requirements|
|Note||Heatsink/Component Clamping Pressure (Recommended): 5 to 100 PSI (0.035 to 0.690 MPa)|
|Materials||Phase Change Temperature: 58°C
Volume Resistivity: 1x 1015 Ohm-cm
|Product Length||1.2 in [30 mm]|
|Product Width||1.2 in [30 mm]|
|Product Height||0 in [0.1 mm]|
|Operating Temperature||-60°C to 125°C (-76°F to 257°F)|
|Shipping (Package) Weight||0 lb [0 kg]|
|What's in the Box|
|Included in Package||5 - Thermal Pad|
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound
Provide optimal heat transfer between CPU and heatsink through a metal oxide compound
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* Product appearance and specifications are subject to change without notice.
* Same day shipping is only available for orders shipping within the United States.