Discontinued

Thermal CPU Paste Compound for Heatsink

Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound

Product ID: HEATGREASE

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  • Ceramic-based compound containing silicone
  • Thermal conductivity of more than 1.066 W/m-K

This thermal CPU paste can be used to improve the effectiveness of a CPU cooler by thermally bonding the CPU to the heatsink, allowing the heatsink and fan to work at their full capacity to remove the harmful heat away from the CPU.

Applications

  • Replace old or dried out thermal paste
  • Add thermal compound to a new system build for the CPU

The StarTech.com Advantage

  • Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
  • Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
  • Ceramic based compound that is electrically non-conductive for safe use around electronics

Partner Numbers

  • UPC 065030783422

Specifications

Warranty Information Warranty 2 Years
Packaging Information Package Length 3.3 in [84 mm]
Package Width 0.9 in [22 mm]
Package Height 6.0 in [15.2 cm]
Shipping (Package) Weight 0.7 oz [20 g]
What's in the Box 1 - Included in Package Thermal Compound

Drivers/Downloads

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Datasheet

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Compliance and safety

Compliance letters

Safety Measures

  • If product has an exposed circuit board, do not touch the product under power.
  • If Class 1 Laser Product. Laser radiation is present when the system is open.
  • Wiring terminations should not be made with the product and/or electric lines under power.
  • Product installation and/or mounting should be completed by a certified professional as per the local safety and building code guidelines.
  • Cables (including power and charging cables) should be placed and routed to avoid creating electric, tripping or safety hazards.
*Product appearance and specifications are subject to change without notice.

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